Flip chip意思

"Flip chip" is a type of semiconductor packaging technology where the active side of the chip (the side with the circuitry) is flipped over and mounted face-down onto a substrate or another circuit board. This is in contrast to traditional packaging methods where the chip is mounted with the active side up.

In a flip chip package, the electrical connections between the chip and the substrate are made through bumps or other types of interconnects on the underside of the chip. These bumps are typically made of solder, gold, or other conductive materials, and they provide a direct connection between the chip and the substrate, which can improve the electrical performance and reliability of the package.

Flip chip packaging is commonly used in a variety of electronic devices, including smartphones, tablets, computers, and other consumer electronics. It is particularly well-suited for applications that require high-speed performance and low power consumption, such as processors, graphics chips, and memory modules.